CARBONYL IRON POWDER

Grade Main Application Type Fe (%) C (%) N (%) O (%) D50 Value (Microns) Coating / Special Properties
ACPI CIP SQ-I Electronic Components Soft min. 98.5 max. 0.03 max. 0.7 3.8-5.4 Insulated
ACPI CIP CC Metal Injection Molding & Powder Metallurgy Soft min. 99.5 max. 0.05 max. 0.01 0.18-0.35 3.8-5.3 Silicated
ACPI CIP CD Powder Metallurgy & Diamond Tools Soft min. 99.5 max. 0.05 max. 0.25 4.2-6.3
ACPI CIP CF Diamond Tools & Nutritional Supplements Soft min. 99.5 max. 0.03 max. 0.01 max. 0.23 max. 9.5
ACPI CIP CM Powder Metallurgy Soft min. 99.5 max. 0.03 max. 0.01 0.1-0.25 7.0-9.5
ACPI CIP CN Powder Metallurgy & Diamond Synthesis/ Tools Soft min. 99.5 max. 0.03 max. 0.01 0.10-0.25 6.5-8.0
ACPI CIP CS Powder Metallurgy Soft min. 99.5 max. 0.03 max. 0.01 0.12-0.30 6.0-7.0
ACPI CIP EM Electronic Components & Microwave Absorption Hard min. 97.0 0.65-0.85 0.6-0.8 0.1-0.3 4.5-6
ACPI CIP ER Microwave Absorption Hard min. 97.0 max. 1.0 max. 1.0 max. 0.8 max. 4.5 Silicated
ACPI CIP EW Electronic Components & Microwave Absorption Hard min. 97.0 max. 0.9 max. 0.9 3.0-4.0 Silicated
ACPI CIP EW-I Electronic Components & Microwave Absorption Hard min. 97.0 max. 0.9 3.0-4.0 Insulated
ACPI CIP FM Metal Injection Molding & Others Hard min. 97.5 max. 1.0 max. 1.0 max. 0.5 max. 2.5
ACPI CIP HF Electronic Components Hard min. 97.7 max. 0.9 max. O.9 max. 0.9 max. 2.5
ACPI CIP HQ Electronic Components Hard min. 97.8 0.6-0.9 0.6-0.9 0.3-0.5 max. 2.0
ACPI CIP HQ-I Electronic Components Hard min. 96.0 max. 1.0 1.2-2.3 Insulated
ACPI CIP HS Electronic Components Hard min. 97.5 max. 1.0 max. 1.0 max. 0.5 1.8-2.3
ACPI CIP OF Nutritional Supplements Hard min. 97.0 max. 1.3 max. 0.3 max. 1.4 max. 5.2
ACPI CIP OM Metal Injection Molding Hard min. 97.8 0.75-0.90 0.65-0.90 0.15-0.40 3.9-5.2
ACPI CIP OM-C Metal Injection Molding Hard min. 97.0 0.8-0.9 0.6-0.9 0.25-0.45 3.8-5.1 Silicated
ACPI CIP OS Metal Injection Molding Hard min. 97.5 0.7-0.9 0.5-0.9 0.6-0.9 3.4-4.4 Silicated
ACPI CIP SM Diamond Tools Soft min. 99.0 max. 0.1 max. 0.1 max. 0.55 max. 3.5
ACPI CIP SQ Electronic Components Soft min. 99.5 max. 0.05 max. 022 3.9-5.0 Silicated
ACPI CIP SQ-HT Electronic Components Soft min. 98.0 max. 0.2 max. 0.1 max. 1.5 4.3-5.5 High temperature stable
ACPI CIP SQ-R Electronic Components Soft min. 98.5 0.1-0.25 max. 0.7 3.8-5.4 Corrosion resistant
ACPI CIP SQ-W Electronic Components Soft min. 98.0 max. 0.2 max. 0.1 0.2-1.5 4.0-5.5 Mid temperature stable
ACPI CIP SW-S Electronic Components Soft max. 0.4 3.0-4.5 Insulated
ACPI ZVI MICROSPHERES 200 Groundwater Remediation Hard min. 97.5 max. 1.0 max. 1.0 max. 0.5 max. 5.2 Coating/ Special Properties